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Jan
Standard vs High-TG PCBs: how lamination, drilling, PTH plating, moisture control, and testing change to survive lead-free reflow and heat cycles.
Author Archives: MC PCB Co, Ltd
19
Jan
Jan
High-Tg FR-4 costs more, but it can cut warpage, via cracks, and rework. Learn when it’s worth it for lead-free reflow, HDI, and BGA builds.
19
Jan
Jan
See how PCB stackups change impedance at high frequencies. Compare microstrip vs stripline, Dk/Df, planes, pours, and tolerances so links stay clean.
19
Jan
Jan
See how copper weight changes MCPCB heat spreading, I²R loss, and DFM limits. Learn when thicker copper helps—and when dielectric rules the temps.
19
Jan
Jan
Learn what 1W–4W aluminum-core MCPCB ratings really mean, how dielectric W/m·K changes heat flow, and when 2W, 3W, or 4W makes sense.
19
Jan
Jan
Aluminum core PCBs (MCPCBs) need the right surface finish for yield and reliability. Compare ENIG, lead-free HASL, OSP, immersion silver, and tin in SMT builds.
19
Jan
Jan
Aluminum or copper core for high-power LEDs? Compare heat spreading, dielectric bottlenecks, CTE reliability, and pick the right MCPCB for your build.
19
Jan
Jan
Rigid-flex PCB assembly looks easy until reflow. Learn causes of delamination, warpage, paste issues, and how fixtures and DFM keep yield stable on the line.
19
Jan
Jan
Choosing flex PCB thickness for wearables? Use 0.10–0.30 mm, match dynamic vs static bend, size bend radius, and add stiffeners for real-world use. No guesswork
19
Jan
Jan
Stop rigid-flex cracks fast: set bend radius early, keep vias out, smooth routing, manage stiffeners, choose RA copper, and lock DFM notes for builds.
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Jan
Jan
Rigid-flex PCB design is harder than rigid boards because bends, stackup, transitions, assembly handling, and testing must be solved early to avoid rework.
19
Jan
Jan
RA or ED copper for flex circuits? Learn when bend-life matters, when fine-line etching wins, and how to spec copper for OEM, ODM, and EMS builds—fast DFM tips.